By James J. Licari
"I suggest this e-book with out reservation to all people in electronics who needs to comprehend adhesives, or make judgements approximately adhesives, or both." - George Riley
, Pages vii-viii
, Pages ix-x
1 - Introduction
, Pages 1-37
2 - capabilities and thought of Adhesives
, Pages 39-94
3 - Chemistry, formula, and homes of Adhesives
, Pages 95-168
4 - Adhesive Bonding Processes
, Pages 169-260
5 - Applications
, Pages 261-346
6 - Reliability
, Pages 347-391
7 - attempt and Inspection Methods
, Pages 393-430
, Pages 431-439
, Pages 441-457
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Additional info for Adhesives Technology for Electronic Applications. Materials, Processes, Reliability
5b). Non-Newtonian fluids are also referred to as pseudoplastic or thixotropic. For these materials, the shear rate increases faster than the shear stress.  A second deviation from Newtonian behavior is����������������� in which viscosity increases with increasing shear rate.  ���������� occurs when clusters of filler particles break up and fluidity increases. At rest, fillers exist in clusters and their strength, size, and shape determine the static viscosity of the adhesive. The total surface area of the filler particles also contributes to static viscosity.
Temperature (�C) Gel Time (150°C) 25 150 25 150 25 100 >2 days 5 min >2 days 5 min >3 hrs 5 min 46 ADHESIVES TECHNOLOGY FOR ELECTRONIC APPLICATIONS As a better understanding of the bleedout phenomenon was gained, other techniques were used to reduce bleedout. Vacuum baking the interconnect substrate prior to attaching devices has been reported to reduce bleedout. Several theories have been proposed to explain this. One is that vacuum baking removes adsorbed moisture and other polar surface residues that have a high affinity for the equally polar resin or hardener constituents of the epoxy.
During the 1960s, both one-part and two-part room-temperature vulcanizing (RTV) silicone adhesives were introduced by General Electric and Dow Corning which met a need for higher temperature resistance and higher purity than epoxies. Some of these silicones were convenient to use because they were one-part systems that cured at room temperature on exposure to air moisture. During this early period, polyurethanes were used where flexibility and vibration damping of large components were required.
Adhesives Technology for Electronic Applications. Materials, Processes, Reliability by James J. Licari